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A nanoelectromechanical-switch-based thermal management for 3-D integrated many-core memory-processor system

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A nanoelectromechanical-switch-based thermal management for 3-D integrated many-core memory-processor system

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dc.contributor.author Huang, Xiwei
dc.contributor.author Zhang, Chun
dc.contributor.author Yu, Hao
dc.contributor.author Zhang, Wei
dc.date.accessioned 2012-10-10T09:05:45Z
dc.date.available 2012-10-10T09:05:45Z
dc.date.copyright 2012
dc.date.issued 2012-10-10
dc.identifier.citation Huang, X., Zhang, C., Yu, H., & Zhang, W. (2012). A nanoelectromechanical-switch-based thermal management for 3-D integrated many-core memory-processor system. IEEE Transactions on Nanotechnology, 11(3), 588-600.
dc.identifier.uri http://hdl.handle.net/10220/8749
dc.description.abstract Tera-scale has become the recent interest for high-performance computing system. In order to increase bandwidth yet decrease power, 3-D integrated many-core memory-processor system is one of the most promising solutions. However, the increased power density and longer vertical heat-removal path in 3-D can result in thermal reliability concerns such as thermal runaway and thermal stability, which pose a significant barrier for tera-scale applications. Due to “green-switch” properties such as zero leakage current, infinite subthreshold slope, and temperature resilient behavior, nanoelectromechanical switches (NEMS) are explored in this paper to mitigate the thermal reliability issues for 3-D integrated many-core memory-processor system. The NEMS-based thermal management for 3-D integrated many-core memory-processor system is examined from device, circuit, and system levels, respectively. Moreover, one real-time thermal management is developed for improving system reliability with the use of NEMS-based thermal buffer and power gating. Experimental results show that our proposed approach can effectively prevent the thermal runaway and also maintain high thermal stability for 3-D integrated many-core memory-processor system.
dc.language.iso en
dc.relation.ispartofseries IEEE transactions on nanotechnology
dc.rights © 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [DOI: http://dx.doi.org/10.1109/TNANO.2012.2186822].
dc.subject DRNTU::Engineering::Electrical and electronic engineering.
dc.title A nanoelectromechanical-switch-based thermal management for 3-D integrated many-core memory-processor system
dc.type Journal Article
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1109/TNANO.2012.2186822
dc.description.version Accepted version
dc.identifier.rims 163300

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