Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/100640
Title: Atomic diffusion behavior in Cu-Al explosive welding process
Authors: Liu, K. X.
Li, X. J.
Luo, N.
Lu, Guoxing.
Chen, S. Y.
Wu, Z. W.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2013
Source: Chen, S. Y., Wu, Z. W., Liu, K. X., Li, X. J., Luo, N., & Lu, G. (2013). Atomic diffusion behavior in Cu-Al explosive welding process. Journal of Applied Physics, 113(4).
Series/Report no.: Journal of applied physics
Abstract: A hybrid method is proposed to study atomic diffusion behavior in Cu-Al explosive welding process. The method combines molecular dynamics simulation and classical diffusion theory. Cu-Al explosive welding and scanning electron microscope experiments are done to verify the method. Using the method, we find that the atomic diffusion mostly takes place in the unloading stage of the welding process. The diffusion coefficients are collision velocity-dependent, with higher velocities generating larger coefficients. When there is no transverse velocity, the diffusion coefficient is directly proportional to the longitudinal velocity. With the longitudinal velocity fixed, the diffusion coefficient is proportional to the square of the transverse velocity. The thickness of the diffusion layer is calculated from the simulation result, and it is in good agreement with the experiment result.
URI: https://hdl.handle.net/10356/100640
http://hdl.handle.net/10220/9936
ISSN: 00218979
DOI: 10.1063/1.4775788
Schools: School of Mechanical and Aerospace Engineering 
Rights: © 2013 American Institute of Physics. This paper was published in Journal of Applied Physics and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following official DOI: http://dx.doi.org/10.1063/1.4775788. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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