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Now showing items 1-8 of 8

Date	Title	Author	Type
1997	The blister test : transition from plate to membrane behaviour for an elastic material.	Cotterell, Brian.; Chen, Zhong.	Journal Article
2000	Buckling and cracking of thin ﬁlms on compliant substrates under compression.	Cotterell, Brian.; Chen, Zhong.	Journal Article
1999	Characterizing the interfacial fracture toughness for microelectronic packaging.	Chen, Zhong.; Cotterell, Brian.; Chen, W. T.	Journal Article
1998	The essential work of fracture and JR curves for the double cantilever beam specimen : an examination of elastoplastic crack propagation.	Atkins, A. G.; Chen, Zhong.; Cotterell, Brian.	Journal Article
2002	The fracture of brittle thin films on compliant substrates in flexible displays.	Chen, Zhong.; Cotterell, Brian.; Wang, Wei.	Journal Article
2001	A mechanical assessment of flexible optoelectronic devices.	Chen, Zhong.; Cotterell, Brian.; Wang, Wei.; Guenther, Ewald.; Chua, Soo-Jin.	Journal Article
2003	Prediction of the energy dissipation rate in ductile crack propagation.	Atkins, A. G.; Chen, Zhong.; Cotterell, Brian.	Journal Article
2003	The strength of the silicon die in flip-chip assemblies.	Cotterell, Brian.; Chen, Z.; Han, J. B.; Tan, N. X.	Journal Article

Now showing items 1-8 of 8