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Date	Title	Author	Type
2007	Analytical modeling of reservoir effect on electromigration in Cu interconnects.	Gan, Zhenghao.; Gusak, A. M.; Shao, W.; Chen, Zhong.; Mhaisalkar, S. G.; Zaporozhets, T.; Tu, K. N.	Journal Article
2007	Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride.	Zhang, Xi.; Chen, Zhong.; Tu, K. N.	Journal Article
2008	Pulse electroplating of copper film : a study of process and microstructure.	Zhang, X.; Tu, K. N.; Chen, Z.; Tan, Y. K.; Wong, Chee C.; Mhaisalkar, S. G.; Li, X. M.; Tung, C. H.; Cheng, C. K.	Journal Article
2006	Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects.	Gan, Z. H.; Shao, W.; Mhaisalkar, S. G.; Chen, Z.; Li, Hongyu.; Tu, K. N.; Gusak, A. M.	Journal Article

Now showing items 1-4 of 4