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https://hdl.handle.net/10356/3576
Title: | New techniques for localization of shorted and open interconnect failures in ICs by using laser beam technology | Authors: | Thaw Zin Myint. | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits | Issue Date: | 2004 | Abstract: | Open-circuit and short-circuit defects in electrical conductors within integrated circuits (ICs) can result in major IC yield and reliability problems. A capability for localizing and identifying these types of defects is important for analyzing ICs to determine failure mechanisms therein, for qualifying ICs as known-good devices, and for implementing corrective action during IC fabrication to minimize the occurrence of such defects. | URI: | http://hdl.handle.net/10356/3576 | Schools: | School of Electrical and Electronic Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Theses |
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EEE-THESES_1424.pdf Restricted Access | 13.43 MB | Adobe PDF | View/Open |
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