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https://hdl.handle.net/10356/46949
Title: | Chip-package codesign of 5 GHz RF receiver front end | Authors: | Wang, Junjun | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio | Issue Date: | 2006 | Source: | Wang, J. J. (2006). Chip-package codesign of 5 GHz RF receiver front end. Doctoral thesis, Nanyang Technological University, Singapore. | Abstract: | Nowadays, the demand for smaller and lighter portable electronics is driving both the semiconductor and packaging industries to increase integration density for radio frequency (RF) transceivers. Chip-package codesign opens a new era for integration, as the package is now part of the circuit. However, there are many problems to be solved for chip-package codesign. | Description: | 170 p. | URI: | https://hdl.handle.net/10356/46949 | DOI: | 10.32657/10356/46949 | Schools: | School of Electrical and Electronic Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Theses |
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File | Description | Size | Format | |
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EEE_THESES_280.pdf | 17.35 MB | Adobe PDF | View/Open |
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