Browsing by Author Chen, Z.


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Showing results 16 to 26 of 26 < previous 
Issue DateTitleAuthor(s)
2009Mechanistic investigations of photo-driven processes over TiO2 by in-situ DRIFTS-MS : Part 1 - platinization and methanol reformingHighfield, J. G.; Chen, M. H.; Nguyen, P. T.; Chen, Z.
2010A micromechanism study of thermosonic gold wire bonding on aluminium padXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, S. S.; White, Timothy John; Chen, Z.; Sivakumar, M.; Acoff, V. L.
2013Palladium-coated and bare copper wire study for ultra-fine pitch wire bondingLim, A. B. Y.; Chang, A. C. K.; Lee, C. X.; Yauw, O.; Chylak, B.; Chen, Z.
 2020Plane-strain consolidation theory with distributed drainage boundaryChen, Z.; Ni, Pengpeng; Chen, Y.; Mei, G.
 2008Pulse electroplating of copper film : a study of process and microstructureZhang, X.; Tu, K. N.; Chen, Z.; Tan, Y. K.; Wong, Chee C.; Mhaisalkar, Subodh Gautam; Li, X. M.; Tung, Chih Hang; Cheng, C. K.
2009A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization padsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, S. S.; White, Timothy John; Chen, Z.
 2020Reduced graphene oxide with controllably intimate bifunctionality for the catalytic transformation of fructose into 2,5-diformylfuran in biphasic solvent systemsChen, Z.; Liao, S.; Ge, Liya; Amaniampong, P. N.; Min, Y.; Wang, C.; Li, K.; Lee, Jong-Min
2006Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnectsShao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu
2007Self-assembled monolayers for reduced temperature direct metal thermocompression bondingAng, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.
 2003The strength of the silicon die in flip-chip assembliesChen, Z.; Han, J. B.; Tan, N. X.; Cotterell, Brian
2010Tribological properties of Cr- and Ti-doped MoS2 composite coatings under different humidity atmosphereDing, Xing-zhao.; Zeng, X. T.; He, X. Y.; Chen, Z.