Browsing by Author Chen, Z.


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Issue DateTitleAuthor(s)
2009A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization padsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, S. S.; White, Timothy John; Chen, Z.
 2020Reduced graphene oxide with controllably intimate bifunctionality for the catalytic transformation of fructose into 2,5-diformylfuran in biphasic solvent systemsChen, Z.; Liao, S.; Ge, Liya; Amaniampong, P. N.; Min, Y.; Wang, C.; Li, K.; Lee, Jong-Min
2006Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnectsShao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu
2007Self-assembled monolayers for reduced temperature direct metal thermocompression bondingAng, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.
 2003The strength of the silicon die in flip-chip assembliesChen, Z.; Han, J. B.; Tan, N. X.; Cotterell, Brian
2010Tribological properties of Cr- and Ti-doped MoS2 composite coatings under different humidity atmosphereDing, Xing-zhao.; Zeng, X. T.; He, X. Y.; Chen, Z.