Browsing by Author Chen, Zhong


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Issue DateTitleAuthor(s)
2018Design and durability study of environmental-friendly room-temperature processable icephobic coatingsWu, Xinghua; Zhao, Xin; Ho, Jeffrey Weng Chye; Chen, Zhong
 2011Dual-phase titanate/anatase with nitrogen doping for enhanced degradation of organic dye under visible lightKanhere, Pushkar D.; Schreyer, Martin K.; Cheng, Yu Hua; Huang, Yizhong; Subramaniam, Vishnu-Priya; Gong, Dangguo; Zhang, Sam; Highfield, James; Chen, Zhong
2019Durable waterborne hydrophobic bio-epoxy coating with improved anti-icing and self-cleaning performanceZheng, Shunli; Bellido-Aguilar, Daniel Angel; Wu, Xinghua; Zhan, Xuejun; Huang, Yinjuan; Zeng, Xianting; Zhang, Qichun; Chen, Zhong
2019Effect of a fluoroalkyl-functional curing agent on the wettability, thermal and mechanical properties of hydrophobic biobased epoxy coatingsBellido-Aguilar, Daniel Angel; Zheng, Shunli; Zhan, Xuejun; Huang, Yinjuan; Zhao, Xin; Zeng, Xianting; Pallathadka, Pramoda K.; Zhang, Qichun; Chen, Zhong
2014Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnectionHu, Xiao; Yang, Ying; Chen, Zhong; Chan, Yan Cheong; Xu, Sha
2004Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solderKumar, A.; Teo, P. S.; He, Min; Chen, Zhong
 2008Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizationsKumar, Aditya; Yang, Ying; Wong, Chee C.; Kripesh, Vaidhyanathan; Chen, Zhong
2006Effect of electron beam treatment on adhesion of Ta/polymeric low-k interfaceDamayanti, M.; Prasad, K.; Chen, Zhe; Zhang, Sam; Jiang, Ning; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam
2005Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrateKumar, Aditya; Chen, Zhong; Mhaisalkar, Subodh Gautam; Wong, Chee Cheong; Teo, Poi Siong; Kripesh, Vaidhyanathan
 2011Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta–Ni thin filmsYan, Hua; Santoso, Raissa Nathania; Jiang, Yueyue; Liang, Meng Heng; Chen, Zhong
 2006Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflowsMona, M.; Chen, Zhong; Kumar, Aditya
2003Effect of plating parameters on the intrinsic stress in electroless nickel platingChen, Zhong; Xu, Xiaoda; Wong, Chee C.; Mhaisalkar, Subodh Gautam
2004Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam
 2018Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solderZhu, Ze; Chan, Yan-Cheong; Chen, Zhong; Gan, Chee-Lip; Wu, Fengshun
2014Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnectionYang, Ying; Chen, Zhong; Hu, Xiao; Xu, Sha; Chan, Y. C.
 2015Effect of titania nano-fillers on the fracture toughness and mechanical performance of hybrid sol-gel coatingsWei, Mengyao; Ho, Jeffrey Weng Chye; Chen, Zhong
 2013Efficient Ag@AgCl cubic cage photocatalysts profit from ultrafast plasmon-induced electron transfer processesTang, Yuxin; Jiang, Zhelong; Xing, Guichuan; Li, Anran; Kanhere, Pushkar D.; Zhang, Yanyan; Sum, Tze Chien; Li, Shuzhou; Chen, Xiaodong; Dong, Zhili; Chen, Zhong
 2012Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentationShen, Lu; Septiwerdani, Pradita; Chen, Zhong
2006Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin filmsChen, Zhong; He, Min; Balakrisnan, Bavani; Chum, Chan Choy
2004Electroless copper seed layer deposition on tantalum nitride barrier filmChong, S. P.; Law, S. B.; Ee, Elden Yong Chiang; Chen, Zhong