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Chen, Zhong
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Showing results 51 to 70 of 256
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Issue Date
Title
Author(s)
2019
Effect of a fluoroalkyl-functional curing agent on the wettability, thermal and mechanical properties of hydrophobic biobased epoxy coatings
Bellido-Aguilar, Daniel Angel
;
Zheng, Shunli
;
Zhan, Xuejun
;
Huang, Yinjuan
;
Zhao, Xin
;
Zeng, Xianting
;
Pallathadka, Pramoda K.
;
Zhang, Qichun
;
Chen, Zhong
2014
Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection
Hu, Xiao
;
Yang, Ying
;
Chen, Zhong
;
Chan, Yan Cheong
;
Xu, Sha
2004
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
Kumar, A.
;
Teo, P. S.
;
He, Min
;
Chen, Zhong
2008
Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations
Kumar, Aditya
;
Yang, Ying
;
Wong, Chee C.
;
Kripesh, Vaidhyanathan
;
Chen, Zhong
2006
Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface
Damayanti, M.
;
Prasad, K.
;
Chen, Zhe
;
Zhang, Sam
;
Jiang, Ning
;
Gan, Zhenghao
;
Chen, Zhong
;
Mhaisalkar, Subodh Gautam
2005
Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate
Kumar, Aditya
;
Chen, Zhong
;
Mhaisalkar, Subodh Gautam
;
Wong, Chee Cheong
;
Teo, Poi Siong
;
Kripesh, Vaidhyanathan
2011
Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta–Ni thin films
Yan, Hua
;
Santoso, Raissa Nathania
;
Jiang, Yueyue
;
Liang, Meng Heng
;
Chen, Zhong
2006
Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
Mona, M.
;
Chen, Zhong
;
Kumar, Aditya
2003
Effect of plating parameters on the intrinsic stress in electroless nickel plating
Chen, Zhong
;
Xu, Xiaoda
;
Wong, Chee C.
;
Mhaisalkar, Subodh Gautam
2004
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
He, Min
;
Chen, Zhong
;
Qi, Guojun
;
Wong, Chee C.
;
Mhaisalkar, Subodh Gautam
2020
Effect of punching edge deformation on the magnetic properties of Fe₄₉-Co₄₉-V₂ alloy
Li, Zhiqiang
;
Chen, Zhong
;
Oh, Joo Tien
;
Wang, Zijing
;
Li, Feng
;
Lambourne, Alexis
2018
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
Zhu, Ze
;
Chan, Yan-Cheong
;
Chen, Zhong
;
Gan, Chee-Lip
;
Wu, Fengshun
2014
Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
Yang, Ying
;
Chen, Zhong
;
Hu, Xiao
;
Xu, Sha
;
Chan, Y. C.
2015
Effect of titania nano-fillers on the fracture toughness and mechanical performance of hybrid sol-gel coatings
Wei, Mengyao
;
Ho, Jeffrey Weng Chye
;
Chen, Zhong
2013
Efficient Ag@AgCl cubic cage photocatalysts profit from ultrafast plasmon-induced electron transfer processes
Tang, Yuxin
;
Jiang, Zhelong
;
Xing, Guichuan
;
Li, Anran
;
Kanhere, Pushkar D.
;
Zhang, Yanyan
;
Sum, Tze Chien
;
Li, Shuzhou
;
Chen, Xiaodong
;
Dong, Zhili
;
Chen, Zhong
2012
Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation
Shen, Lu
;
Septiwerdani, Pradita
;
Chen, Zhong
2006
Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
Chen, Zhong
;
He, Min
;
Balakrisnan, Bavani
;
Chum, Chan Choy
2023
Electrical tree modelling in dielectric polymers using a phase-field regularized cohesive zone model
Wang, Qi
;
Deng, Yuheng
;
Yap, Malvern
;
Yang, Yan
;
Ma, Jielin
;
Chern, Wen Kwang
;
Li, Jin
;
Chen, Zhong
2004
Electroless copper seed layer deposition on tantalum nitride barrier film
Chong, S. P.
;
Law, S. B.
;
Ee, Elden Yong Chiang
;
Chen, Zhong
2012
Electronic structure, optical properties, and photocatalytic activities of LaFeO3–NaTaO3 solid solution
Kanhere, Pushkar D.
;
Nisar, Jawad
;
Tang, Yuxin
;
Pathak, Biswarup
;
Ahuja, Rajeev
;
Zheng, Jianwei
;
Chen, Zhong