Showing results 35 to 54 of 199
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| Issue Date | Title | Author(s) |
 | 2019 | Effect of a fluoroalkyl-functional curing agent on the wettability, thermal and mechanical properties of hydrophobic biobased epoxy coatings | Bellido-Aguilar, Daniel Angel; Zheng, Shunli; Zhan, Xuejun; Huang, Yinjuan; Zhao, Xin; Zeng, Xianting; Pallathadka, Pramoda K.; Zhang, Qichun; Chen, Zhong |
 | 2014 | Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection | Hu, Xiao; Yang, Ying; Chen, Zhong; Chan, Yan Cheong; Xu, Sha |
| 2004 | Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder | Kumar, A.; Teo, P. S.; He, Min; Chen, Zhong |
| | 2008 | Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations | Kumar, Aditya; Yang, Ying; Wong, Chee C.; Kripesh, Vaidhyanathan; Chen, Zhong |
| 2006 | Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface | Damayanti, M.; Prasad, K.; Chen, Zhe; Zhang, Sam; Jiang, Ning; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam |
| 2005 | Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate | Kumar, Aditya; Chen, Zhong; Mhaisalkar, Subodh Gautam; Wong, Chee Cheong; Teo, Poi Siong; Kripesh, Vaidhyanathan |
| | 2011 | Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta–Ni thin films | Yan, Hua; Santoso, Raissa Nathania; Jiang, Yueyue; Liang, Meng Heng; Chen, Zhong |
| | 2006 | Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows | Mona, M.; Chen, Zhong; Kumar, Aditya |
| 2003 | Effect of plating parameters on the intrinsic stress in electroless nickel plating | Chen, Zhong; Xu, Xiaoda; Wong, Chee C.; Mhaisalkar, Subodh Gautam |
| 2004 | Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization | He, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam |
| | 2018 | Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder | Zhu, Ze; Chan, Yan-Cheong; Chen, Zhong; Gan, Chee-Lip; Wu, Fengshun |
| 2014 | Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection | Yang, Ying; Chen, Zhong; Hu, Xiao; Xu, Sha; Chan, Y. C. |
| | 2015 | Effect of titania nano-fillers on the fracture toughness and mechanical performance of hybrid sol-gel coatings | Wei, Mengyao; Ho, Jeffrey Weng Chye; Chen, Zhong |
| | 2013 | Efficient Ag@AgCl cubic cage photocatalysts profit from ultrafast plasmon-induced electron transfer processes | Tang, Yuxin; Jiang, Zhelong; Xing, Guichuan; Li, Anran; Kanhere, Pushkar D.; Zhang, Yanyan; Sum, Tze Chien; Li, Shuzhou; Chen, Xiaodong; Dong, Zhili; Chen, Zhong |
| | 2012 | Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation | Shen, Lu; Septiwerdani, Pradita; Chen, Zhong |
| 2006 | Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films | Chen, Zhong; He, Min; Balakrisnan, Bavani; Chum, Chan Choy |
| 2004 | Electroless copper seed layer deposition on tantalum nitride barrier film | Chong, S. P.; Law, S. B.; Ee, Elden Yong Chiang; Chen, Zhong |
| | 2012 | Electronic structure, optical properties, and photocatalytic activities of LaFeO3–NaTaO3 solid solution | Kanhere, Pushkar D.; Nisar, Jawad; Tang, Yuxin; Pathak, Biswarup; Ahuja, Rajeev; Zheng, Jianwei; Chen, Zhong |
| 2009 | Electrophoretic deposition of titanate nanotube films with extremely large wetting contrast | Lai, Yuekun; Chen, Yicong; Tang, Yuxin; Gong, Dangguo; Chen, Zhong; Lin, Changjian |
| 2019 | Elucidating the sources of activity and stability of FeP electrocatalyst for hydrogen evolution reactions in acidic and alkaline media | Zhao, Xin; Zhang, Zheng; Cao, Xun; Hu, Jun; Wu, Xinghua; Ng, Andrew Yun Ru; Lu, Guo-Ping; Chen, Zhong |
