Browsing by Author Ee, Elden Yong Chiang


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Issue DateTitleAuthor(s)
2006Copper diffusion in Ti–Si–N layers formed by inductively coupled plasma implantationXu, S.; Lai, M. Y.; Yakovlev, N. L.; Law, S. B.; Chen, Z.; Ee, Elden Yong Chiang
2004Effect of processing parameters on electroless Cu seed layer propertiesChen, Z.; Chan, L.; See, Alex K. H.; Law, S. B.; Zeng, K. Y.; Shen, L.; Tee, K. C.; Ee, Elden Yong Chiang
2004Electroless copper deposition as a seed layer on TiSiN barrierChen, Z.; Xu, S.; Chan, L.; See, K. H.; Law, S. B.; Ee, Elden Yong Chiang
2004Electroless copper seed layer deposition on tantalum nitride barrier filmChong, S. P.; Law, S. B.; Ee, Elden Yong Chiang; Chen, Zhong
 2011Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stressLim, Meng Keong; Lin, Jingyuan; Ee, Elden Yong Chiang; Ng, Chee Mang; Wei, Jun; Gan, Chee Lip
2005Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma processRutkevych, P. P.; Zeng, K. Y.; Chen, Z.; Chan, L.; See, K. H.; Law, S. B.; Xu, S.; Tsakadze, Z. L.; Shen, L.; Ee, Elden Yong Chiang
2006Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier filmsLu, T. M.; Law, S. B.; Chen, Z.; Ee, Elden Yong Chiang; Dong, Zhili
2006Plasma assisted deposition of Ti-Si-N and Ti-Si-N-O diffusion barrier filmsEe, Elden Yong Chiang