Browsing by Author Ee, Elden Yong Chiang
Showing results 3 to 9 of 9
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2004 | Effect of processing parameters on electroless Cu seed layer properties | Chen, Z.; Chan, L.; See, Alex K. H.; Law, S. B.; Zeng, K. Y.; Shen, L.; Tee, K. C.; Ee, Elden Yong Chiang |
| 2004 | Electroless copper deposition as a seed layer on TiSiN barrier | Chen, Z.; Xu, S.; Chan, L.; See, K. H.; Law, S. B.; Ee, Elden Yong Chiang |
| 2004 | Electroless copper seed layer deposition on tantalum nitride barrier film | Chong, S. P.; Law, S. B.; Ee, Elden Yong Chiang; Chen, Zhong |
| 2011 | Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress | Lim, Meng Keong; Lin, Jingyuan; Ee, Elden Yong Chiang; Ng, Chee Mang; Wei, Jun; Gan, Chee Lip | |
| 2005 | Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process | Rutkevych, P. P.; Zeng, K. Y.; Chen, Z.; Chan, L.; See, K. H.; Law, S. B.; Xu, S.; Tsakadze, Z. L.; Shen, L.; Ee, Elden Yong Chiang |
| 2006 | Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier films | Lu, T. M.; Law, S. B.; Chen, Z.; Ee, Elden Yong Chiang; Dong, Zhili |
| 2006 | Plasma assisted deposition of Ti-Si-N and Ti-Si-N-O diffusion barrier films | Ee, Elden Yong Chiang |