Browsing by Author Fan, Ji


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Showing results 2 to 5 of 5 < previous 
Issue DateTitleAuthor(s)
 2012Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stackingPeng, L.; Li, H. Y.; Fan, Ji; Gao, Shan; Tan, Chuan Seng
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
 2012Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stackingPeng, L.; Zhang, L.; Li, H. Y.; Fan, Ji; Lim, Dau Fatt; Tan, Chuan Seng
 2012Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliabilityPeng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng