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Fan, Ji
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Showing results 2 to 5 of 5
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Issue Date
Title
Author(s)
2012
Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking
Peng, L.
;
Li, H. Y.
;
Fan, Ji
;
Gao, Shan
;
Tan, Chuan Seng
2012
Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds
Tan, Chuan Seng
;
Peng, Lan
;
Fan, Ji
;
Li, Hong Yu
;
Gao, Shan
2012
Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking
Peng, L.
;
Zhang, L.
;
Li, H. Y.
;
Fan, Ji
;
Lim, Dau Fatt
;
Tan, Chuan Seng
2012
Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
Peng, L.
;
Fan, Ji
;
Li, Kwok Hung
;
Tan, Chuan Seng