Showing results 33 to 52 of 82
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| Issue Date | Title | Author(s) |
| 2018 | Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors | Gao, Yu; Gan, Chee Lip; Thompson, C. V.; Sasangka, W. A. |
| 2012 | Impact of pre-existing voids on electromigration in copper interconnects | Mario, Hendro; Lim, Meng Keong; Gan, Chee Lip |
| 2013 | Improved mechanical and thermomechanical properties of alumina substrate via iron doping | Made, Riko I.; Phua, Eric Jian Rong; Pramana, Stevin Snellius; Wong, Chee Cheong; Chen, Zhong; Gan, Chee Lip; Tok, Alfred Iing Yoong |
| 2017 | Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation | Sasangka, W. A.; Syaranamual, G. J.; Gao, Yu; Made, Riko I; Gan, Chee Lip; Thompson, C. V. |
| 2021 | Improvements in the modulus and strength of multi-dimensional hybrid composites through synergistic reinforcement between 1D fiber and 0D particle fillers | Markandan, Kalaimani; Kanaujia, Pawan Kumar; Abhineet, Jain Palash; Yap, Xiu Yun; Gan, Chee Lip; Lai, Chang Quan |
| 2023 | Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress | Tan, H. T.; Gao, Y.; Syaranamual, G. J.; Sasangka, W. A.; Foo, Siew Chuen; Lee, K. H.; Arulkumaran, Subramaniam; Ng, Geok Ing; Thompson, C. V.; Gan, Chee Lip |
| 2019 | Iron-facilitated dynamic active-site generation on spinel CoAl₂O₄ with self-termination of surface reconstruction for water oxidation | Wu, Tianze; Sun, Shengnan; Song, Jiajia; Xi, Shibo; Du, Yonghua; Chen, Bo; Sasangka, Wardhana Aji; Liao, Hanbin; Gan, Chee Lip; Scherer, Günther G.; Zeng, Lin; Wang, Haijiang; Li, Hui; Grimaud, Alexis; Xu, Zhichuan Jason |
| 2013 | Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect | Chun, Shu Rong; Sasangka, Wardhana Aji; Ng, Mei Zhen; Liu, Qing; Du, Anyan; Zhu, Jie; Ng, Chee Mang; Liu, Zhi Qiang; Chiam, Sing Yang; Gan, Chee Lip |
| 2014 | Laser focus depth adaptation for decapsulation of copper wirebonded devices | Kor, Katherine Hwee Boon; Liu, Qing; Siah, Yu Wen; Gan, Chee Lip |
| 2013 | A low-profile three-dimensional neural probe array using a silicon lead transfer structure | Cheng, Ming-Yuan; Je, Minkyu; Tan, Kwan Ling; Tan, Ee Lim; Lim, Ruiqi; Yao, Lei; Li, Peng; Park, Woo-Tae; Phua, Eric Jian Rong; Gan, Chee Lip; Yu, Aibin |
| 2021 | Mechanical properties and failure behaviour of architected alumina microlattices fabricated by stereolithography 3D printing | Yap, Xiu Yun; Seetoh, Ian; Goh, Wei Liang; Ye, Pengcheng; Zhao, Yida; Du, Zehui; Lai, Chang Quan; Gan, Chee Lip |
| 2019 | Mechanical response of lightweight hollow truss metal oxide lattices | Kanaujia, Pawan Kumar; Muhammad Azkhairy Ramezan; Yap, Xiu Yun; Song, Yujie; Du, Zehui; Gan, Chee Lip; Lam, Yee Cheong; Lai, Chang Quan |
| 2012 | Metal electroplating of three dimensional (3D) electrode in electrolyte-less dye sensitized solar cells (ELDSC) | Lim, Meng Keong; Jin, Ziyu; Gan, Chee Lip; Leong, Kam Chew; Wong, C. C.; Ong, Duen Yang |
| 2017 | Metal-sulfide-decorated ZnO/Si nano-heterostructure arrays with enhanced photoelectrochemical performance | Yadian, Boluo; Rao, Yuhan; Zhu, Bowen; Liu, Zhifeng; Liu, Qing; Gan, Chee Lip; Chen, Xiaodong; Huang, Yizhong |
| 2022 | Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times | Yan, Guangxu; Gill, Vincent; Gan, Chee Lip; Chen, Zhong |
| 2015 | Microstructure, crystallization and shape memory behavior of titania and yttria co-doped zirconia | Zeng, Xiao Mei; Du, Zehui; Schuh, Christopher A.; Tamura, Nobumichi; Gan, Chee Lip |
| 2010 | Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface | Made, Riko I.; Gan, Chee Lip; Tan, Chuan Seng |
| 2010 | Network-enhanced photoresponse time of Ge nanowire photodetectors | Yan, Chaoyi; Singh, Nandan; Cai, Hui; Gan, Chee Lip; Lee, Pooi See |
| 2012 | Nickel cobalt oxide-single wall carbon nanotube composite material for superior cycling stability and high-performance supercapacitor application | Lim, Mengfang; Singh, Nandan; Gan, Chee Lip; Wang, Xu; Han, Xuanding; Jan, Ma; Lee, Pooi See |
| 2018 | Novel high temperature polymeric encapsulation material for extreme environment electronics packaging | Phua, Eric Jian Rong; Liu, Ming; Cho, Bokun; Liu, Qing; Amini, Shahrouz; Hu, Xiao; Gan, Chee Lip |