Browsing by Author
Han, Yongdian
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) |
| 2012 | Applications of multi-walled carbon nanotube in electronic packaging | Tan, Cher Ming; Baudot, Jacques Desire Charles; Han, Yongdian; Jing, Hongyang |
| 2012 | Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes | Nai, S. M. L.; Xu, L. Y.; Wei, J.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming |
| 2009 | Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth | Nai, S. M. L.; Xu, L. Y.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming; Wei, Jun |
| 2012 | Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints | Nai, S. M. L.; Xu, L. Y.; Wei, J.; Jing, Hongyang; Tan, Cher Ming; Han, Yongdian |
| 2012 | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling | Nai, S. M. L.; Xu, L. Y.; Wei, J.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming |
| 2008 | A new creep model for SnAgCu lead-free composite solders : incorporating back stress | Nai, S. M. L.; Xu, L. Y.; Zhang, S. R.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming; Wei, Jun |