Browsing by Author He, Min
Showing results 5 to 10 of 10
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2004 | Interfacial reaction between Sn-rich solders and Ni-based metallization | Kumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong |
| 2004 | Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction | He, Min; Lau, Wee Hua; Qi, Guojun; Chen, Zhong |
| 2012 | Investigating the effects of solid surfaces on ice nucleation | Li, Kaiyong; Xu, Shun; Shi, Wenxiong; He, Min; Li, Huiling; Li, Shuzhou; Zhou, Xin; Wang, Jianjun; Song, Yanlin | |
| 2005 | Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints | He, Min; Chen, Zhong; Qi, Guojun |
| 2004 | Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization | Chen, Zhong; He, Min; Qi, Guojun | |
| 2004 | Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization | He, Min; Chen, Zhong; Qi, Guojun |