Browsing by Author He, Min


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Showing results 5 to 10 of 10 < previous 
Issue DateTitleAuthor(s)
2004Interfacial reaction between Sn-rich solders and Ni-based metallizationKumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong
2004Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reactionHe, Min; Lau, Wee Hua; Qi, Guojun; Chen, Zhong
 2012Investigating the effects of solid surfaces on ice nucleationLi, Kaiyong; Xu, Shun; Shi, Wenxiong; He, Min; Li, Huiling; Li, Shuzhou; Zhou, Xin; Wang, Jianjun; Song, Yanlin
2005Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder jointsHe, Min; Chen, Zhong; Qi, Guojun
 2004Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallizationChen, Zhong; He, Min; Qi, Guojun
2004Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun