Browsing by Author He, Min
Showing results 8 to 10 of 10
< previous
| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2005 | Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints | He, Min; Chen, Zhong; Qi, Guojun |
| 2004 | Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization | Chen, Zhong; He, Min; Qi, Guojun | |
| 2004 | Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization | He, Min; Chen, Zhong; Qi, Guojun |