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Jing, Hongyang
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Showing results 3 to 6 of 6
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Issue Date
Title
Author(s)
2009
Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth
Nai, S. M. L.
;
Xu, L. Y.
;
Han, Yongdian
;
Jing, Hongyang
;
Tan, Cher Ming
;
Wei, Jun
2012
Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
Nai, S. M. L.
;
Xu, L. Y.
;
Wei, J.
;
Jing, Hongyang
;
Tan, Cher Ming
;
Han, Yongdian
2012
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
Nai, S. M. L.
;
Xu, L. Y.
;
Wei, J.
;
Han, Yongdian
;
Jing, Hongyang
;
Tan, Cher Ming
2008
A new creep model for SnAgCu lead-free composite solders : incorporating back stress
Nai, S. M. L.
;
Xu, L. Y.
;
Zhang, S. R.
;
Han, Yongdian
;
Jing, Hongyang
;
Tan, Cher Ming
;
Wei, Jun