| Issue Date | Title | Author(s) |
| 2021 | Advanced 3D integration technologies in various quantum computing devices | Zhao, Peng; Lim, Yu Dian; Li, Hong Yu; Guidoni, Luca; Tan, Chuan Seng |
| 2022 | Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly | Zhao, Peng; Li, Hong Yu; Lim, Yu Dian; Hu, Liangxing; Seit, Wen Wei; Guidoni, Luca; Tan, Chuan Seng |
| 2020 | Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking | Apriyana, Anak Agung Alit; Li, Hong Yu; Zhao, Peng; Tao, Jing; Lim, Yu Dian; Lin, Ye; Guidoni, Luca; Tan, Chuan Seng |
| 2021 | Design and fabrication of grating couplers for the optical addressing of trapped ions | Lim, Yu Dian; Li, Hong Yu; Zhao, Peng; Tao, Jing; Guidoni, Luca; Tan, Chuan Seng |
| 2013 | Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits | Made, Riko I.; Peng, Lan; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng |
| 2020 | Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) | Lin, Ye; Li, Hong Yu; Tan, Chuan Seng |
| 2022 | The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device | Zhao, Peng; Li, Hong Yu; Lim, Yu Dian; Seit, Wen Wei; Guidoni, Luca; Tan, Chuan Seng |
| 2012 | Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief | Ghosh, Kaushik; Zhang, Jiye; Zhang, Lin; Dong, Yuanwei; Li, Hong Yu; Tan, Cher Ming; Xia, Guangrui; Tan, Chuan Seng |
| 2021 | Large-scale fabrication of surface ion traps on a 300 mm glass wafer | Tao, Jing; Likforman, Jean-Pierre; Zhao, Peng; Li, Hong Yu; Henner, Theo; Lim, Yu Dian; Seit, Wen Wei; Guidoni, Luca; Tan, Chuan Seng |
| 2012 | Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization | Tan, Chuan Seng; Lim, Dau Fatt; Peng, Lan; Li, Hong Yu |
| 2006 | Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects | Shao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu |
| 2021 | RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing | Zhao, Peng; Li, Hong Yu; Tao, Jing; Likforman, Jean-Pierre; Lim, Yu Dian; Seit, Wen Wei; Luca, Guidoni; Tan, Chuan Seng |
| 2023 | Simplified Assembly of Through-Silicon-Via Integrated Ion Traps | Zhao, Peng; Li, Hong Yu; Likforman, Jean-Pierre; Henner, Theo; Lim, Yu Dian; Hu, Liang Xing; Seit, Wen Wei; Luca, Guidoni; Tan, Chuan Seng |
| 2011 | Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits | Made, Riko I.; Lan, Peng; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng |
| 2020 | Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate | Tao, Jing; Li, Hong Yu; Lim, Yu Dian; Zhao, Peng; Apriyana, Anak Agung Alit; Guidoni, Luca; Tan, Chuan Seng |
| 2012 | Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds | Tan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan |
| 2012 | Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current | Zhang, Lin; Lim, Dau Fatt; Li, Hong Yu; Gao, Shan; Tan, Chuan Seng |
| 2021 | TSV-integrated surface electrode ion trap for scalable quantum information processing | Zhao, Peng; Likforman, J. P.; Li, Hong Yu; Tao, Jing; Henner, T.; Lim, Yu Dian; Seit, W. W.; Tan, Chuan Seng; Guidoni, Luca |