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Li, Hong Yu
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Showing results 9 to 18 of 18
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Issue Date
Title
Author(s)
2021
Large-scale fabrication of surface ion traps on a 300 mm glass wafer
Tao, Jing
;
Likforman, Jean-Pierre
;
Zhao, Peng
;
Li, Hong Yu
;
Henner, Theo
;
Lim, Yu Dian
;
Seit, Wen Wei
;
Guidoni, Luca
;
Tan, Chuan Seng
2012
Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization
Tan, Chuan Seng
;
Lim, Dau Fatt
;
Peng, Lan
;
Li, Hong Yu
2006
Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects
Shao, W.
;
Chen, Z.
;
Tu, K. N.
;
Gusak, A. M.
;
Gan, Zhenghao
;
Mhaisalkar, Subodh Gautam
;
Li, Hong Yu
2021
RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing
Zhao, Peng
;
Li, Hong Yu
;
Tao, Jing
;
Likforman, Jean-Pierre
;
Lim, Yu Dian
;
Seit, Wen Wei
;
Luca, Guidoni
;
Tan, Chuan Seng
2023
Simplified Assembly of Through-Silicon-Via Integrated Ion Traps
Zhao, Peng
;
Li, Hong Yu
;
Likforman, Jean-Pierre
;
Henner, Theo
;
Lim, Yu Dian
;
Hu, Liang Xing
;
Seit, Wen Wei
;
Luca, Guidoni
;
Tan, Chuan Seng
2011
Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits
Made, Riko I.
;
Lan, Peng
;
Li, Hong Yu
;
Gan, Chee Lip
;
Tan, Chuan Seng
2020
Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate
Tao, Jing
;
Li, Hong Yu
;
Lim, Yu Dian
;
Zhao, Peng
;
Apriyana, Anak Agung Alit
;
Guidoni, Luca
;
Tan, Chuan Seng
2012
Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds
Tan, Chuan Seng
;
Peng, Lan
;
Fan, Ji
;
Li, Hong Yu
;
Gao, Shan
2012
Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current
Zhang, Lin
;
Lim, Dau Fatt
;
Li, Hong Yu
;
Gao, Shan
;
Tan, Chuan Seng
2021
TSV-integrated surface electrode ion trap for scalable quantum information processing
Zhao, Peng
;
Likforman, J. P.
;
Li, Hong Yu
;
Tao, Jing
;
Henner, T.
;
Lim, Yu Dian
;
Seit, W. W.
;
Tan, Chuan Seng
;
Guidoni, Luca