Browsing by Author Li, Hong Yu


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Showing results 4 to 8 of 8 < previous 
Issue DateTitleAuthor(s)
 2012Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realizationTan, Chuan Seng; Lim, Dau Fatt; Peng, Lan; Li, Hong Yu
2006Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnectsShao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu
2011Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuitsMade, Riko I.; Lan, Peng; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
 2012Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage currentZhang, Lin; Lim, Dau Fatt; Li, Hong Yu; Gao, Shan; Tan, Chuan Seng