Browsing by Author Li, Hong Yu


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Issue DateTitleAuthor(s)
2011Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuitsMade, Riko I.; Lan, Peng; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
 2012Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage currentZhang, Lin; Lim, Dau Fatt; Li, Hong Yu; Gao, Shan; Tan, Chuan Seng