Browsing by Author Li, Kwok Hung
Showing results 44 to 44 of 44
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 2012 | Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability | Peng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng |