Browsing by Author Li, Kwok Hung
Showing results 45 to 45 of 45
< previous
Issue Date | Title | Author(s) | |
---|---|---|---|
2012 | Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability | Peng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng |