Browsing by Author Li, Kwok Hung


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Showing results 44 to 44 of 44 < previous 
Issue DateTitleAuthor(s)
 2012Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliabilityPeng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng