Browsing by Author Lim, Ju Dy

Showing results 1 to 3 of 3
Issue DateTitleAuthor(s)
2011Improving adhesion of copper thin films of alumina substrate through interface engineeringLim, Ju Dy
2013Surface roughness effect on copper–alumina adhesionLim, Ju Dy; Yeow, Su Yi Susan; Rhee, MinWoo Daniel; Leong, Kam Chew; Wong, Chee Cheong
2017Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrateLim, Ju Dy; Lee, Pui Mun; Chen, Zhong