Browsing by Author Peng, Lan

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Showing results 2 to 4 of 4 < previous 
Issue DateTitleAuthor(s)
 2012Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realizationTan, Chuan Seng; Lim, Dau Fatt; Peng, Lan; Li, Hong Yu
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
2012Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuitsPeng, Lan