Browsing by Author Peng, Lan


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Showing results 3 to 4 of 4 < previous 
Issue DateTitleAuthor(s)
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
2012Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuitsPeng, Lan