Showing results 3 to 22 of 64
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| Issue Date | Title | Author(s) |
| 2012 | Barrier height determination of Au/Oxidized GaAs/n-GaAs using ballistic electron emission spectroscopy | Bosman, Michel; Ong, Beng Sheng; Chiam, Sing Yang; Pey, Kin Leong; Qin, Hailang; Liu, Zhiqiang; Troadec, Cedric; Goh, Johnson Kuan Eng |
| 2004 | Characterization of the junction leakage of Ti-capped Ni-silicided junctions | Lee, Pooi See; Pey, Kin Leong; Toledo, N. G. |
| 2013 | Charge transport in lightly reduced graphene oxide : a transport energy perspective | Kajen, R. S.; Pey, Kin Leong; Vijila, C.; Jaiswal, M.; Saravanan, S.; Ng, Andrew M. H.; Wong, C. P.; Loh, K. P.; Chandrasekhar, Natarajan |
| 2001 | Comparative study of current-voltage characteristics of Ni and Ni(Pt)- alloy silicided p+/n diodes | Mangelinck, D.; Lahiri, S. K.; Chi, Dong Zhi; Lee, Pooi See; Pey, Kin Leong |
| 2011 | Comparison between chemical vapor deposited and physical vapor deposited WSi2 metal gate for InGaAs n-metal-oxide-semiconductor field-effect transistors | Ong, B. S.; Pey, Kin Leong; Ong, C. Y.; Tan, Chuan Seng; Antoniadis, D. A.; Fitzgerald, E. A. |
| 2008 | Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel | Cui, Guangda; Lee, Pooi See; Chi, Dong Zhi; Chin, Yoke King; Hoe, Keat Mun; Tan, Eu Jin; Pey, Kin Leong; Singh, Navab; Lo, Guo-Qiang |
| 2012 | Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena | Pey, Kin Leong; Raghavan, Nagarajan; Wu, Xing; Liu, Wenhu; Bosman, Michel |
| 2012 | Effect of copper TSV annealing on via protrusion for TSV wafer fabrication | Heryanto, A.; Putra, W. N.; Trigg, Alastair David; Gao, S.; Kwon, W. S.; Che, Faxing; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip; Pey, Kin Leong |
| 2002 | Effect of ion implantation on layer inversion of Ni silicided poly-Si | Mangelinck, D.; Osipowicz, T.; Dai, J. Y.; Chan, L.; Lee, Pooi See; Pey, Kin Leong; Ding, Jun; Chi, Dong Zhi |
| 2012 | Effect of surface contamination on electron tunneling in the high bias range | Qin, Hailang; Goh, Johnson Kuan Eng; Bosman, Michel; Li, Xiang; Pey, Kin Leong; Troadec, Cedric |
| 2005 | Effect of Ti alloying in nickel silicide formation | Setiawan, Y.; Tan, C. W.; Lee, Pooi See; Pey, Kin Leong |
| 2005 | Effects of Si(001) surface amorphization on ErSi2 thin film | Pey, Kin Leong; Lee, Pooi See; Tan, Eu Jin; Kon, M. L.; Zhang, Y. W.; Wang, W. D.; Chi, Dong Zhi |
| 2004 | Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate | Li, Y. S.; Lee, Pooi See; Pey, Kin Leong |
| 2012 | The electronic barrier height of silicon native oxides at different oxidation stages | Qin, H. L.; Goh, K. E. J.; Troadec, C.; Bosman, Michel; Pey, Kin Leong |
| 2002 | Enhanced stability of Ni monosilicide on MOSFETs poly-Si gate stack | Mangelinck, D.; Osipowicz, T.; Dai, J. Y.; See, A.; Lee, Pooi See; Pey, Kin Leong; Ding, Jun; Chi, Dong Zhi |
| 2008 | Erbium silicided schottky source/drain silicon nanowire N-metal–oxide–semiconductor field-effect transistors | Tan, Eu Jin; Pey, Kin Leong; Singh, Navab; Chi, Dong Zhi; Lo, Guo-Qiang; Lee, Pooi See; Hoe, Keat Mun; Chin, Yoke King; Cui, Guangda |
| 2009 | Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects | Made, Riko I.; Thompson, Carl V.; Leong, H. L.; Li, H. Y.; Gan, Chee Lip; Pey, Kin Leong |
| 2012 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Made, Riko I.; Thompson, Carl V.; Gan, Chee Lip; Yan, Li Ling; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong |
| 2011 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Yan, Li Ling; Gan, Chee Lip; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong; Made, Riko I.; Thompson, Carl V. |
| 2008 | An extensive study on the boron junctions formed by optimized pre-spike∕multiple-pulse flash lamp annealing schemes : junction formation, stability and leakage | Tan, Dexter Xue Ming; Pey, Kin Leong; Yeong, S. H.; Colombeau, B.; Poon, C. H.; Mok, K. R. C.; See, A.; Benistant, F.; Ng, C. M.; Chan, L.; Srinivasan, M. P. |