Showing results 10 to 15 of 15
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| Issue Date | Title | Author(s) |
| | 2012 | Percolative model and thermodynamic analysis of oxygen-ion-mediated resistive switching | Raghavan, Nagarajan; Pey, Kin Leong; Wu, Xing; Liu, Wenhu; Bosman, Michel |
 | 2018 | A rapid design exploration framework under additive manufacturing process uncertainty | Xiong, Yi; Duong, Pham Luu Trung; Raghavan, Nagarajan; Rosen, David W |
| 2013 | Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress | Raghavan, Nagarajan; Padovani, Andrea; Li, Xiang; Bosman, Michel; Wu, Xing; Lip Lo, Vui; Larcher, Luca; Leong Pey, Kin |
| | 2012 | Role of grain boundary percolative defects and localized trap generation on the reliability statistics of high-κ gate dielectric stacks | Raghavan, Nagarajan; Pey, Kin Leong; Shubhakar, K.; Wu, X.; Liu, W. H.; Bosman, Michel |
| 2008 | Statistical modeling of via redundancy effects on interconnect reliability | Tan, Cher Ming; Raghavan, Nagarajan |
| 2012 | Triggering voltage for post-breakdown random telegraph noise in HfLaO dielectric metal gate metal-oxide-semiconductor field effect transistors and its reliability implications | Liu, W. H.; Pey, Kin Leong; Raghavan, Nagarajan; Wu, X.; Bosman, Michel |
