| Issue Date | Title | Author(s) |
 | 2001 | Analysis of heat dissipation and thermal enhancements in electronic packages | Loh, Chiah Vern. |
| 1998 | Analysis of temperature profile on a PCB in the preheat section of a wave soldering process | Hoe, Swee Long. |
| | 2020 | Convective filmwise condensation on the outer surface of a vertical tube : a theoretical analysis | Liu, Pengfei; Ho, Jin Yao; Wong, Teck Neng; Toh, Kok Chuan |
| 1995 | Development of a technique for thermal visualisation of heat transfer from fins using laser holographic interferometry | Leong, Kai Choong; Liu, Chang Yu; Tam, Siu Chung; Toh, Kok Chuan; Tso, Chih Ping |
| 2002 | Development of compact thermal models for advanced electronic packages | Xie, Ming. |
| 2004 | Direct liquid cooling of stacked multichip modules | Chen, Xuyang. |
| 2000 | Experimental and numerical evaluation of heat sink performance | Viswanathan Chinniah |
| 2005 | Fluid flow and heat transfer characteristics in microchannels | Ang, Gabriel Pau Hwee; Toh, Kok Chuan; Ooi, Kim Tiow; Wong, Teck Neng |
| 2000 | Heat dissipation in ball grid array packages | Ying, Teck Mun. |
| | 2020 | Influence of air on heat transfer of a closed-loop spray cooling system | Liu, Pengfei; Kandasamy, Ranjith; Feng, Huicheng; Wong, Teck Neng; Toh, Kok Chuan |
| 1999 | Investigation of the performance of a thermosyphon pin fin heat sink | Sun, Jianchun. |
| | 2020 | Laminar film condensation inside and outside vertical diverging/converging small channels : a theoretical study | Liu, Pengfei; Ho, Jin Yao; Wong, Teck Neng; Toh, Kok Chuan |
 | 2008 | A procedure for the motion of particle-encapsulated droplets in microchannels | Yap, Yit Fatt; Chai, J. C.; Wong, Teck Neng; Nguyen, Nam-Trung; Toh, Kok Chuan; Zhang, H. Y.; Yobas, Levent |
| | 2022 | Two-phase spray cooling for high ambient temperature data centers: evaluation of system performance | Kandasamy, Ranjith; Ho, Jin Yao; Liu, Pengfei; Wong, Teck Neng; Toh, Kok Chuan; Chua, Sunshine Jr |
