Browsing by Author Toh, Kok Chuan


Or, select a letter below to browse by last name
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Showing results 4 to 14 of 14 < previous 
Issue DateTitleAuthor(s)
1995Development of a technique for thermal visualisation of heat transfer from fins using laser holographic interferometryLeong, Kai Choong; Liu, Chang Yu; Tam, Siu Chung; Toh, Kok Chuan; Tso, Chih Ping
2002Development of compact thermal models for advanced electronic packagesXie, Ming.
2004Direct liquid cooling of stacked multichip modulesChen, Xuyang.
2000Experimental and numerical evaluation of heat sink performanceViswanathan Chinniah
2005Fluid flow and heat transfer characteristics in microchannelsAng, Gabriel Pau Hwee; Toh, Kok Chuan; Ooi, Kim Tiow; Wong, Teck Neng
2000Heat dissipation in ball grid array packagesYing, Teck Mun.
 2020Influence of air on heat transfer of a closed-loop spray cooling systemLiu, Pengfei; Kandasamy, Ranjith; Feng, Huicheng; Wong, Teck Neng; Toh, Kok Chuan
1999Investigation of the performance of a thermosyphon pin fin heat sinkSun, Jianchun.
 2020Laminar film condensation inside and outside vertical diverging/converging small channels : a theoretical studyLiu, Pengfei; Ho, Jin Yao; Wong, Teck Neng; Toh, Kok Chuan
2008A procedure for the motion of particle-encapsulated droplets in microchannelsYap, Yit Fatt; Chai, J. C.; Wong, Teck Neng; Nguyen, Nam-Trung; Toh, Kok Chuan; Zhang, H. Y.; Yobas, Levent
 2022Two-phase spray cooling for high ambient temperature data centers: evaluation of system performanceKandasamy, Ranjith; Ho, Jin Yao; Liu, Pengfei; Wong, Teck Neng; Toh, Kok Chuan; Chua, Sunshine Jr