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Wei, J.
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Showing results 4 to 16 of 16
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Issue Date
Title
Author(s)
2010
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution
Xu, Hui
;
Liu, Changqing
;
Chen, Z.
;
Wei, J.
;
Sivakumar, M.
;
Silberschmidt, Vadim V.
2008
Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
Ang, X. F.
;
Chen, Z.
;
Wong, Chee C.
;
Wei, J.
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication
Heryanto, A.
;
Putra, W. N.
;
Trigg, Alastair David
;
Gao, S.
;
Kwon, W. S.
;
Che, Faxing
;
Ang, X. F.
;
Wei, J.
;
Made, Riko I.
;
Gan, Chee Lip
;
Pey, Kin Leong
2012
Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
Nai, S. M. L.
;
Xu, L. Y.
;
Wei, J.
;
Jing, Hongyang
;
Tan, Cher Ming
;
Han, Yongdian
2016
Functionally graded material by additive manufacturing
Tan, K. E.
;
Choy, S. Y.
;
Sun, C. N.
;
Leong, K. F.
;
Wei, J.
2012
Imparting photosensitivity through decoration of nanoparticle on reduced graphene oxide
Wei, J.
;
Tjoa, Verawati
;
Mathews, Nripan
;
Mhaisalkar, Subodh Gautam
2012
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
Nai, S. M. L.
;
Xu, L. Y.
;
Wei, J.
;
Han, Yongdian
;
Jing, Hongyang
;
Tan, Cher Ming
2011
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
Ang, X. F.
;
Wei, J.
;
Leong, K. C.
;
Tan, Chuan Seng
;
Lim, Dau Fatt
2012
Mechanism of different switching directions in graphene oxide based RRAM
Wang, Zhongrui
;
Tjoa, Verawati
;
Wu, L.
;
Liu, W. J.
;
Fang, Z.
;
Tran, Xuan Anh
;
Wei, J.
;
Zhu, W. G.
;
Yu, Hongyu
2012
Positive bias-induced Vth instability in graphene field effect transistors
Liu, W. J.
;
Fang, Z.
;
Wang, Z. R.
;
Wang, F.
;
Wu, L.
;
Zhang, J. F.
;
Wei, J.
;
Zhu, H. L.
;
Sun, Xiaowei
;
Tran, Xuan Anh
;
Ng, Geok Ing
;
Yu, Hongyu
2014
Selective Laser Melting of Density Graded TI6AL4V
Low, Kin Huat
;
Sun, C. N.
;
Leong, Kah Fai
;
Liu, Zhong Hong
;
Zhang, Dan Qing
;
Wei, J.
2007
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding
Ang, X. F.
;
Li, F. Y.
;
Tan, W. L.
;
Chen, Z.
;
Wong, Chee C.
;
Wei, J.
2012
Vth shift in single-layer graphene field-effect transistors and its correlation with Raman inspection
Wei, J.
;
Liu, W. J.
;
Fang, Z.
;
Wang, Z. R.
;
Wang, F.
;
Wu, L.
;
Zhang, J. F.
;
Zhu, H. L.
;
Sun, Xiaowei
;
Tran, Xuan Anh
;
Yu, Hongyu