Browsing by Author Xu, Cheng
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2018 | Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology | Xu, Cheng |
| 2018 | An anonymous handover authentication scheme based on LTE-A for vehicular networks | Xu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong |
| 2019 | Evaluation of fan-out wafer level package strength | Xu, Cheng; Zhong, Zhao-Wei; Choi, Won-kyoung | |
| 2017 | A privacy-preserving and cross-domain group authentication scheme for vehicular in LTE-A networks | Xu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong |
| 2018 | A secure and efficient message authentication scheme for vehicular networks based on LTE-V | Xu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong |
| 2018 | Thermal test effect on fan-out wafer level package strength | Xu, Cheng; Zhong, Zhao Wei; Choi, W. K. |