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Yu, H.
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Showing results 4 to 4 of 4
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Issue Date
Title
Author(s)
2014
TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal
Tan, Chuan Seng
;
Razzaq, A.
;
Wee, K. H.
;
Li, K. H.
;
Yu, H.
;
Chua, S. L.