Browsing by Author Anantha, P.

Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)
2016Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnectsGan, Chee Lip; Tan, Chuan Seng; Dai, Y. Y.; Ng, M. Z.; Anantha, P.; Lin, Y. D.; Li, Z. G.
2015Geometry and thermal stress analysis of in-plane outgassing channels in Al2O3-intermediated InP (die)-to-Si (wafer) bondingLin, Yiding; Anantha, P.; Lee, Kwang Hong; Chua, Shen Lin; Shang, Lingru; Tan, Chuan Seng
2016Germanium-on-silicon nitride waveguides for mid-infrared integrated photonicsLi, Wei; Anantha, P.; Bao, Shuyu; Lee, Kwang Hong; Guo, Xin; Hu, Ting; Zhang, Lin; Wang, Hong; Soref, Richard; Tan, Chuan Seng
2017Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applicationsLee, Kwang Hong; Bao, Shuyu; Lin, Yiding; Wang, Yue; Li, Wei; Zhang, Lin; Michel, Jurgen; Fitzgerald, Eugene A.; Tan, Chuan Seng; Anantha, P.
 2014Homogeneous chip to wafer bonding of InP-Al2O3-Si using UV/O3 activationTan, Chuan Seng; Anantha, P.
 2013Modeling of nucleation and growth during vapor condensation on liquid substratesAnantha, P.; Cheng, Ting; Wong, Chee Cheong
2018Spiral waveguides on germanium-on-silicon nitride platform for mid-IR sensing applicationsLi, Wei; Anantha, P.; Lee, Kwang Hong; Qiu, Hao Dong; Guo, Xin; Goh, Simon Chun Kiat; Zhang, Lin; Wang, Hong; Soref, Richard A.; Tan, Chuan Seng
 2013Thermal Characteristics of InP-Al2O3/Si Low Temperature Heterogeneous Direct Bonding for Photonic Device IntegrationFan, J.; Anantha, P.; Liu, C. Y.; Bergkvist, M.; Wang, H.; Tan, Chuan Seng
2015UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bondingAnantha, P.; Tan, Chuan Seng