Browsing by Author Ang, X. F.

Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
2007Critical temperatures in thermocompression gold stud bondingZhang, G. G.; Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
2008Effect of chain length on low temperature gold-gold bonding by self assembled monolayersAng, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
 2012Effect of copper TSV annealing on via protrusion for TSV wafer fabricationHeryanto, A.; Putra, W. N.; Trigg, Alastair David; Gao, S.; Kwon, W. S.; Che, Faxing; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip; Pey, Kin Leong
 2010In-situ monitoring of the thermal desorption of alkanethiols with surface plasmon resonance spectroscopy (SPRS)Wong, Chee Cheong; Romanato, Filippo; Lee, Kwang Hong; Ang, X. F.; Li, J.
 2011Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancementAng, X. F.; Wei, J.; Leong, K. C.; Tan, Chuan Seng; Lim, Dau Fatt
2007Self-assembled monolayers for reduced temperature direct metal thermocompression bondingAng, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.