| Issue Date | Title | Author(s) |
 | 2011 | 3D current path in stacked devices : metrics and challenges | Kor, H. B.; Infante, F.; Perdu, P.; Gan, C. L.; Lewis, D. |
| 2012 | Effect of nickel silicide induced dopant segregation on vertical silicon nanowire diode performance | Tan, Chuan Seng; Lu, W.; Pey, K. L.; Singh, N.; Leong, K. C.; Liu, Q.; Gan, C. L.; Lo, G. Q.; Kwong, D. -L. |
| | 2012 | Impact of field enhancement on TDDB lifetimes of Cu/Low-k test structures | Gan, C. L.; Tan, T. L.; Ong, R. X. |
| 2011 | Magnetic field spatial fourier analysis : a new opportunity for high resolution current localization | Gan, C. L.; Lewis, D.; Infante, F.; Perdu, P.; Kor, H. B. |
| 2012 | Study of charge distribution and charge loss in dual-layer metal-nanocrystal-embedded high-κ/SiO2 gate stack | Lwin, Z. Z.; Pey, Kin Leong; Zhang, Q.; Bosman, Michel; Liu, Q.; Gan, C. L.; Singh, P. K.; Mahapatra, S. |
| 2010 | Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages | Kor, H. B.; Chang, A. C. K.; Gan, C. L. |
| 2013 | Uniform delayering of copper metallization | Siah, Yu Wen; Hong, Y. J.; Liu, Q.; Kor, Katherine Hwee Boon; Gan, C. L. |
