| Issue Date | Title | Author(s) |
 | 2007 | Analytical modeling of reservoir effect on electromigration in Cu interconnects | Zaporozhets, T.; Tu, K. N.; Gusak, A. M.; Shao, W.; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam |
| | 2011 | Applications of finite element methods for reliability study of ULSI interconnections | Tan, Cher Ming; Li, Wei; Gan, Zhenghao |
| 2004 | Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects | Tan, Cher Ming; Zhang, Guan; Gan, Zhenghao |
| 2006 | Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface | Damayanti, M.; Prasad, K.; Chen, Zhe; Zhang, Sam; Jiang, Ning; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam |
| 2003 | Failure mechanisms of aluminum bondpad peeling during thermosonic bonding | Tan, Cher Ming; Gan, Zhenghao |
| 2007 | Fracture toughness measurement of thin films on compliant substrate using controlled buckling test | Chen, Zhong; Gan, Zhenghao |
| 2006 | Modification of Ta/polymeric low-k interface by electron beam treatment | Prasad, K.; Damayanti, M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Chen, Zhong; Chen, Zhe; Zhang, Sam; Jiang, Ning |
| 2003 | Nondestructive void size determination in copper metallization under passivation | Gan, Zhenghao; Tan, Cher Ming; Zhang, Guan |
| 2006 | Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects | Shao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu |
| 2004 | Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test | Prasad, K.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Chen, Zhong; Zhang, Sam; Chen, Zhe |
| 2003 | Temperature and stress distribution in the SOI structure during fabrication | Tan, Cher Ming; Gan, Zhenghao; Gao, Xiaofang |
