Browsing by Author Gan, Zhenghao

Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
2007Analytical modeling of reservoir effect on electromigration in Cu interconnectsZaporozhets, T.; Tu, K. N.; Gusak, A. M.; Shao, W.; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam
 2011Applications of finite element methods for reliability study of ULSI interconnectionsTan, Cher Ming; Li, Wei; Gan, Zhenghao
2004Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnectsTan, Cher Ming; Zhang, Guan; Gan, Zhenghao
2006Effect of electron beam treatment on adhesion of Ta/polymeric low-k interfaceDamayanti, M.; Prasad, K.; Chen, Zhe; Zhang, Sam; Jiang, Ning; Gan, Zhenghao; Chen, Zhong; Mhaisalkar, Subodh Gautam
2003Failure mechanisms of aluminum bondpad peeling during thermosonic bondingTan, Cher Ming; Gan, Zhenghao
2007Fracture toughness measurement of thin films on compliant substrate using controlled buckling testChen, Zhong; Gan, Zhenghao
2006Modification of Ta/polymeric low-k interface by electron beam treatmentPrasad, K.; Damayanti, M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Chen, Zhong; Chen, Zhe; Zhang, Sam; Jiang, Ning
2003Nondestructive void size determination in copper metallization under passivationGan, Zhenghao; Tan, Cher Ming; Zhang, Guan
2006Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnectsShao, W.; Chen, Z.; Tu, K. N.; Gusak, A. M.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Li, Hong Yu
2004Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending testPrasad, K.; Gan, Zhenghao; Mhaisalkar, Subodh Gautam; Chen, Zhong; Zhang, Sam; Chen, Zhe
2003Temperature and stress distribution in the SOI structure during fabricationTan, Cher Ming; Gan, Zhenghao; Gao, Xiaofang