Browsing by Author He, Min

Showing results 1 to 10 of 10
Issue DateTitleAuthor(s)
2004Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solderKumar, Aditya; He, Min; Chen, Zhong
2004Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solderKumar, A.; Teo, P. S.; He, Min; Chen, Zhong
2004Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam
2006Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin filmsChen, Zhong; He, Min; Balakrisnan, Bavani; Chum, Chan Choy
2004Interfacial reaction between Sn-rich solders and Ni-based metallizationKumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong
2004Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reactionHe, Min; Lau, Wee Hua; Qi, Guojun; Chen, Zhong
 2012Investigating the effects of solid surfaces on ice nucleationLi, Kaiyong; Xu, Shun; Shi, Wenxiong; He, Min; Li, Huiling; Li, Shuzhou; Zhou, Xin; Wang, Jianjun; Song, Yanlin
2005Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder jointsHe, Min; Chen, Zhong; Qi, Guojun
 2004Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallizationChen, Zhong; He, Min; Qi, Guojun
2004Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun