| Issue Date | Title | Author(s) |
 | 2004 | Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder | Kumar, Aditya; He, Min; Chen, Zhong |
| 2004 | Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder | Kumar, A.; Teo, P. S.; He, Min; Chen, Zhong |
| 2004 | Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization | He, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam |
| 2006 | Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films | Chen, Zhong; He, Min; Balakrisnan, Bavani; Chum, Chan Choy |
| 2004 | Interfacial reaction between Sn-rich solders and Ni-based metallization | Kumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong |
| 2004 | Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction | He, Min; Lau, Wee Hua; Qi, Guojun; Chen, Zhong |
| | 2012 | Investigating the effects of solid surfaces on ice nucleation | Li, Kaiyong; Xu, Shun; Shi, Wenxiong; He, Min; Li, Huiling; Li, Shuzhou; Zhou, Xin; Wang, Jianjun; Song, Yanlin |
| 2005 | Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints | He, Min; Chen, Zhong; Qi, Guojun |
| | 2004 | Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization | Chen, Zhong; He, Min; Qi, Guojun |
| 2004 | Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization | He, Min; Chen, Zhong; Qi, Guojun |
