Browsing by Author Huang, Z.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2018 | Ambipolar ferromagnetism by electrostatic doping of a manganite | Zheng, L. M.; Lü, W. M.; Li, C. J.; Paudel, T. R.; Liu, Z. Q.; Huang, Z.; Zeng, S. W.; Han, Kun; Qiu, X. P.; Li, M. S.; Yang, Shize; Wang, Xiao Renshaw; Chen, Z. H; Yang, B.; Chisholm, Matthew F.; Martin, L. W.; Pennycook, S. J.; Tsymbal, E. Y.; Coey, J. M. D.; Cao, W. W. |
| 2017 | Electrical properties and subband occupancy at the (La, Sr)(Al, Ta)O3/SrTiO3 interface | Han, K.; Huang, Z.; Zeng, S. W.; Yang, M.; Li, C. J.; Zhou, W. X.; Wang, Renshaw Xiao; Venkatesan, T.; Coey, J. M. D.; Goiran, M.; Escoffier, W.; Ariando |
| 2017 | Electron transport and visible light absorption in a plasmonic photocatalyst based on strontium niobate | Wan, D. Y.; Zhao, Y. L.; Cai, Y.; Asmara, T. C.; Huang, Z.; Chen, J. Q.; Hong, J.; Yin, Sheng Ming; Nelson, C. T.; Motapothula, M. R.; Yan, B. X.; Xiang, D.; Chi, X.; Zheng, H.; Chen, W.; Xu, Rong; Ariando; Rusydi, A.; Minor, A. M.; Breese, M. B. H.; Sherburne, M.; Asta, M.; Xu, Q-H; Venkatesan, T |
| 2012 | Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions | Pang, John Hock Lye; Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R. |