Browsing by Author Jing, T.
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2019 | Novel solution for high-temperature dielectric application to encapsulate high-voltage power semiconductor devices | Chidambaram, Vivek; Jing, T.; Yang, Ren Bin; Shakerzadeh, Maziar; Hoong, Lim Kuan |