Browsing by Author
Kumar, A.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
| 2004 | Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder | Kumar, A.; Teo, P. S.; He, Min; Chen, Zhong |
| 2006 | Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints | Qi, Guojun; Chen, Z.; He, M.; Kumar, A. |
| 2004 | Interfacial reaction between Sn-rich solders and Ni-based metallization | Kumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong |
| 2023 | On the relationship between the multi-region relaxed variational principle and resistive inner-layer theory | Kumar, A.; Loizu, J.; Hole, M. J.; Qu, Zhisong; Hudson, S. R.; Dewar, R. L. |