Browsing by Author Kumar, A.
Showing results 1 to 3 of 3
|2004||Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder||Kumar, A.; Teo, P. S.; He, Min; Chen, Zhong|
|2006||Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints||Qi, Guojun; Chen, Z.; He, M.; Kumar, A.|
|2004||Interfacial reaction between Sn-rich solders and Ni-based metallization||Kumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong|