Browsing by Author Kumar, A.

Showing results 1 to 3 of 3
Issue DateTitleAuthor(s)
2004Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solderKumar, A.; Teo, P. S.; He, Min; Chen, Zhong
 2006Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder jointsQi, Guojun; Chen, Z.; He, M.; Kumar, A.
2004Interfacial reaction between Sn-rich solders and Ni-based metallizationKumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong