Browsing by Author Kumar, Aditya
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) | |
|---|---|---|---|
 | 2004 | Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder | Kumar, Aditya; He, Min; Chen, Zhong |
| 2008 | Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations | Kumar, Aditya; Yang, Ying; Wong, Chee C.; Kripesh, Vaidhyanathan; Chen, Zhong | |
| 2005 | Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate | Kumar, Aditya; Chen, Zhong; Mhaisalkar, Subodh Gautam; Wong, Chee Cheong; Teo, Poi Siong; Kripesh, Vaidhyanathan |
| 2006 | Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows | Mona, M.; Chen, Zhong; Kumar, Aditya | |
| 2006 | Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint | Kumar, Aditya; Chen, Zhong |
| 2010 | Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple | Kumar, Aditya; Chen, Zhong |