Browsing by Author Li, H. Y.

Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
2009Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnectsMade, Riko I.; Thompson, Carl V.; Leong, H. L.; Li, H. Y.; Gan, Chee Lip; Pey, Kin Leong
 2012Operating TSV in stable accumulation capacitance region by utilizing Al2O3-induced negative fixed chargeZhang, L.; Li, H. Y.; Peng, L.; Lo, Guo-Qing; Kwong, Dim Lee; Tan, Chuan Seng
 2012Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stackingPeng, L.; Li, H. Y.; Fan, Ji; Gao, Shan; Tan, Chuan Seng
 2012Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delayZhang, J.; Zhang, L.; Dong, Y.; Li, H. Y.; Ghosh, Kaushik; Tan, Cher Ming; Xia, Guangrui; Tan, Chuan Seng
2015Study of Multilevel High-Resistance States in HfOx-Based Resistive Switching Random Access Memory by Impedance SpectroscopyLi, H. K.; Chen, T. P.; Hu, S. G.; Liu, P.; Liu, Y.; Lee, P. S.; Wang, X. P.; Li, H. Y.; Lo, G. Q.
 2012Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stackingPeng, L.; Zhang, L.; Li, H. Y.; Fan, Ji; Lim, Dau Fatt; Tan, Chuan Seng