Browsing by Author Lim, Dau Fatt

Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
 2013Cu–Cu hermetic seal enhancement using self-assembled monolayer passivationPeng, L.; Leong, K. C.; Lim, Dau Fatt; Fan, Ji; Tan, Chuan Seng
 2012Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integrationPeng, L.; Zhang, L.; Li, H.Y.; Lim, Dau Fatt; Tan, Chuan Seng
 2011Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancementAng, X. F.; Wei, J.; Leong, K. C.; Tan, Chuan Seng; Lim, Dau Fatt
 2012Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realizationTan, Chuan Seng; Lim, Dau Fatt; Peng, Lan; Li, Hong Yu
 2012Single-mode narrow beam divergence surface-emitting concentric-circular-grating terahertz quantum cascade lasersKhanna, Suraj P.; Liang, Guozhen; Liang, Houkun; Zhang, Ying; Li, Lianhe; Davies, A. Giles; Linfield, Edmund; Lim, Dau Fatt; Tan, Chuan Seng; Yu, Siu Fung; Liu, Hui Chun; Wang, Qi Jie
2013Single-mode surface-emitting concentric-circular-grating terahertz quantum cascade lasersLiang, Guozhen; Liang, Houkun; Zhang, Ying; Khanna, Suraj P.; Li, Lianhe; Davies, A. Giles; Linfield, Edmund; Lim, Dau Fatt; Tan, Chuan Seng; Yu, Siu Fung; Liu, Hui Chun; Wang, Qi Jie
 2012Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage currentZhang, Lin; Lim, Dau Fatt; Li, Hong Yu; Gao, Shan; Tan, Chuan Seng
 2012Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stackingPeng, L.; Zhang, L.; Li, H. Y.; Fan, Ji; Lim, Dau Fatt; Tan, Chuan Seng