Browsing by Author
Lin, Ye
Showing results 1 to 9 of 9
| Issue Date | Title | Author(s) |
| 2020 | Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking | Apriyana, Anak Agung Alit; Li, Hong Yu; Zhao, Peng; Tao, Jing; Lim, Yu Dian; Lin, Ye; Guidoni, Luca; Tan, Chuan Seng |
| 2019 | Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via | Lin, Ye |
| 2018 | Dielectric quality of 3D capacitor embedded in through-silicon via (TSV) | Lin, Ye; Tan, Chuan Seng |
| 2020 | Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) | Lin, Ye; Li, Hong Yu; Tan, Chuan Seng |
| 2017 | Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV) | Lin, Ye; Tan, Chuan Seng |
| 2018 | Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias | Lin, Ye; Tan, Chuan Seng |
| 2018 | Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via | Lin, Ye; Tan, Chuan Seng |
| 2019 | RF characterization and design of multi-TSV with embedded capacitor | Panwar, Neeraj; Apriyana, Anak Agung Alit; Lin, Ye; Tan, Chuan Seng |
| 2020 | Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications | Lin, Ye; Apriyana, Anak Agung Alit; Hong, Yu Li; Tan, Chuan Seng |