Browsing by Author Liu, Changqing

Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
2010Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolutionXu, Hui; Liu, Changqing; Chen, Z.; Wei, J.; Sivakumar, M.; Silberschmidt, Vadim V.
 2009Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallizationSilberschmidt, Vadim V.; Xu, Hui; Liu, Changqing; Chen, Zhong
2010A micromechanism study of thermosonic gold wire bonding on aluminium padXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, S. S.; White, Timothy John; Chen, Z.; Sivakumar, M.; Acoff, V. L.
2009A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization padsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, S. S.; White, Timothy John; Chen, Z.